The method reduces the amount of contaminating oxides, thus resulting in better adhesion and improved performance of the devices.

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Technology The invention describes methods and resulting structures in which a metal layer is adhered to a surface of a substrate.  The methods involve applying a sacrificial acidic organic layer to the substrate prior to depositing the metal layer.  The sacrificial layer is consumed, leaving behind a metal/substrae interface that has excellent adhesion properties. Applications include but are not limited to fabrication of micro-electronics, such as integrated circuits.  

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