Register for free to
view the full innovation profile.
The method reduces the amount of contaminating oxides, thus resulting in better adhesion and improved performance of the devices.
About
Technology The invention describes methods and resulting structures in which a metal layer is adhered to a surface of a substrate. The methods involve applying a sacrificial acidic organic layer to the substrate prior to depositing the metal layer. The sacrificial layer is consumed, leaving behind a metal/substrae interface that has excellent adhesion properties. Applications include but are not limited to fabrication of micro-electronics, such as integrated circuits.