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ReUSE® is a patented set of materials and processes that allows the design and manufacture of 100% recyclable and reusable electronics
About
Our ReUSE® patented set of materials and process brings fully recyclable printed circuit assemblies to reality. Current FR4-based circuit assemblies have around 5% recyclability and significantly less reusability of materials and components. ReUSE® provides substrates, circuit tracks, and component bonding systems that can be fully unzipped using organic solvents, significantly reducing the energy and high-costs of recycling. The CO2e saving of a ReUSE-based circuit assembly versus a standard FR4-based circuit assembly is over 10 times.
Key Benefits
Completely unzippable printed circuit electronic assembly allowing Recyclable and Reusable substrates and components, feeding a circular economy. Reusable electronic components saves 2.3Bn Tonnes of C02e per year based on just 2.5% of PCBs being changed to a ReUSE® assembly, which is the equivalent carbon offset of 91 Million mature trees per year. ReUSE® substrates typically consume up to 20x less CO2e to manufacture compared with traditional substrate methods, whilst also being highly economical to recycle. Drive for an opportunity to cease landfill E-waste through 100% recycling of substrates, conductive circuits, and electronic components, via ultra-low energy unzipping and second-life usage for constituent parts.
Applications
Current development provides a more realistic target for 85-95% recyclability for low-complex circuit assemblies such as small to medium size substrate boards and larger pitch components (0306). Smaller pitch components are still possible and development is ongoing for recyclability of BGA gate arrays. Applications such as LED light structures, mouse, and gaming mouse circuit boards, automotive key fobs, HMI circuit boards in domestic, medical, wearable, automotive, aerospace, and industry appliances, would be ideal examples for high-recyclability today.