Highly scalable, low capital infrastructure process technology. Extend the capability of chemical vapour deposition (CVD) and etching processes at atmospheric pressure.

About

About  Advanced materials processing technology enabling a wide range of functional coatings to be deposited at reduced temperatures and with greater process control Extend the capability of chemical vapour deposition (CVD) and etching processes at atmospheric pressure Highly scalable, low capital infrastructure process technology Fast pulsing plasma generation for highly controllable CVD processes Control of etch and/or deposition rates Manipulation of surface structure, crystallinity, composition etc. lms deposited on glass substrates                                  AFM profiles of etched ZnO films  Application  Treatment of thermally sensitive substrates e.g. plastics, composites Removal of wet chemistry-based techniques in manufacture Online, controllable processing for one or both sides of substrate Potential for the deposition of novel materials  Seeking Commercial partnership for further technology development and route to market, with option of exclusive rights to license the technology.  

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