High Thermal Conductivity Mat

About

High Thermal Conductivity Materials for Thermal Management Applications Background: As microelectronic devices such as mobile phones and computers become faster and more powerful, it is becoming increasingly important to manage and efficiently dissipate the heat that these devices produce. Diamond and graphite are known to have exceptionally high thermal conductivities (~2000Wm-1K-1). However, diamonds are expensive, scarce and difficult to produce synthetically, and graphite’s physical properties make it unsuitable for use in many consumer devices. Other materials are substantially less conducive than carbon; for instance, even copper and other metals have thermal conductivities that are approximately four to five times lower. Accordingly, there is a need for new materials that are highly conductive as well as easy and cost-effective to fabricate. Invention: The invention provides materials that demonstrate high thermal conductivities on par with diamond and graphite. In particular, the inventors have identified new criteria that achieve high thermal conductivity in an unconventional way. Features/Advantages:   Materials may be manufactured at a lower cost than diamond Coefficient of thermal expansion (CTE) is better matched to most heat-generating devices (e.g. phone) Applications:   Microprocessors High power radio frequency (RF) devices Light emitting diodes (LEDs) Brake pads Publication: Phys. Rev. Lett. 111, 025901 (2012)   Lead Inventor: David Broido, Ph.D.   Patent Information: International (PCT) application filed   Licensing Status: Available for exclusive or non-exclusive license   Looking for Partners: For sponsored collaboration research to develop and commercialize this invention