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ACA/NCA materials made with the novel ACA/F materials provide high thermo-mechanical properties and thermal conductivities.
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Background: Novel anisotropic conductive adhesive/film (ACA/F) and nonconductive adhesive/film (NCA/F) materials suitable for use as interconnects are provided. Through use of carbon nanotubes, along with gold coated polymer balls, gold coated metallic nickel particles and conventional filler materials, the cost of the ACA/F material may be reduced. ACA/NCA materials made with the novel ACA/F materials provide high thermo-mechanical properties and thermal conductivities. Moreover, the carbon nanotubes can be optimized to reduce the coefficient of thermal expansion while increasing thermal conductivity and maintaining high electrical resistivity. The carbon nanotubes may also redistribute thermo-mechanical stresses caused by the mismatch of coefficients of thermal expansion between the chip and substrate. Thus, use of the novel ACA/NCA materials with flip chip-organic substrate assemblies may improve thermo-mechanical reliability.