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This composite interface has an effective thermal conductivity of 26 Wm-1K-1, which is 5 fold higher than required by industry.
About
Stanford researchers developed a strong, flexible, high heat transfer architecture for electronics packaging interfacial material. The resins currently used in electronics packaging are a thermal management bottleneck. Schematic diagram of packaging system The Stanford developed ‘spatially-architectured interface materials for packaging electronics’ (SIMPEL) can be applied as a tape between dies. The composite interface material contains a high thermal conductor (e.g. Silicon) in a flexible matrix (e.g. Parylene) sandwiched between electrical insulators (e.g. PMMA).This composite interface has an effective thermal conductivity of 26 Wm-1K-1, which is 5 fold higher than required by industry. Stage of Research: Researchers plan to test interface materials and integrate them with packaged chips in the lab.
Key Benefits
Transfers heat well Easily integrated into packaging process
Applications
Semiconductor Electronics Packaging