Electronic and RF Applications

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Technology Printable metallic silver paste formulations developed at UML can be printed on low cost flexible commodity plastic substrates such as PET and thermally transformed to highly conductive silver traces at relatively low temperatures (< 130° C). These inks can be used to fabricate electrical circuits (Inductor-interdigital capacitor) as shown in Figure 1 using simple and low-cost, additive, conformal deposition techniques. The conductive element formed after thermal treatment is substantially free of binders and provides a sharp RF response (high quality 'Q' factor) for your RFID applications. The superior RF response of circuits printed using UML inks compared to those printed using commercially available silver epoxies and other silver inks is shown in Figure 2. RF sensors fabricated using UML inks at low temperatures, exhibit substantially high quality ("Q") factor. Advantages Can be printed on low-cost commodity plastics – Substantially similar cost of ink but greatly reduced cost of substrate. Easily applied to additive, low-cost and commercially viable roll-to-roll fabrication techniques such a rotary screen/gravure/flexographic printing techniques – Substantially similar cost of ink but greatly reduced quantity of ink. Inks are binder-free, providing high quality 'Q' factor for RF applications. Comparable durability but lower overall cost.