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A novel technology for non-conducting convective heat removal.
About
With regards to cooling down high-powered electronics, there is a constant battle between power and weight. Ideally, we strive to achieve a powerful system while maintaining a low profile; however, in reality this extra power creates a need for more efficient cooling systems. Generally, these systems, such as cold plates and heat sinks, are heavy and provide non-uniform cooling across the heat-generating devices. Reliability is therein reduced due to inconsistent damage across the system. The non-metallic localized heat-spreading device addresses both of these issues. First, the non-metallic material composition minimizes the weight needed for adequate cooling. Additionally, by using non-metals, we can avoid EMI resonance typically present with conventional techniques. Secondly, the localized heat spreading capability increases the reliability of an electrical system by decreasing maximum hot-spot temperatures and creating uniform thermal distributions. Therefore we can predict with greater confidence how a system degrades overtime and reduce how often electrical components need replacing.
Key Benefits
Advantage(s): -Light-weight -Hot-spot mitigation -Uniform cooling distribution -Variable cooling performance to accommodate real-world heat loads -Low EMI resonance created -Modular design for application flexibility
Applications
Application(s): -Generators, specifically the conversion of mechanical energy to electrical energy ‚ -Increasing reliability in harvesting renewable energy (wind, solar, hydro-mechanical, geothermal, etc.) -Hybrid and fully electric aircraft propulsion systems, consumer electric vehicles and heavy machinery equipment -General electronic equipment (processors, servers, power distribution hubs)