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A tool to electrodeposit layers of a metal compound at room temperature for building three-dimensional geometries.
About
The demonstrated additive fabrication technology exhibits a dispenser-free nozzle as it operates in solid-state phase. Layers of copper are electrodeposited through a solid media on a conductive substrate and the printed pillar is imaged and its material composition characterized by energy dispersive spectroscopy. Since no dispensing mechanism is required, the system complexity is reduced to a level that the use of micro-engineered nozzle in many multiples is possible for parallel 3D printing.
Key Benefits
Dispense-free nozzle Operable with solid-state of metals System complexity is reduced Enables use of micro-engineered nozzle in many multiples for parallel 3D printing Enables high volume production of 3D printed metal geometries
Applications
3D Printing Microelectronics 3D Printing Aerospace Industry 3D Printing Metal Geometries